The focus has been on Intel Foundry's ability to compete on fab process nodes. But advanced packaging is the foundation on ...

Applied Materials (NasdaqGS:AMAT) has entered a new advanced packaging technology partnership with Broadcom. Broadcom is ...

Applied Materials has agreed to acquire the NEXX business from ASMPT Limited, expanding its advanced packaging tools for AI chipmaking. The deal adds panel level advanced packaging capabilities to ...

Semiconductor manufacturing equipment maker KLA Corporation (NASDAQ:KLAC) reported Q1 CY2025 results , with sales up 29.8% year on year to $3.06 billion. The company expects next quarter’s revenue to ...

ASML (ASML) shipped its first advanced packaging lithography system in late 2025 to expand beyond EUV. Taiwan Semiconductor holds over 50% of the high-end CoWoS advanced packaging market for AI chips.

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...

Intel’s embedded multi-die interconnect bridge (EMIB) technology—aiming to address the growing complexity in heterogeneously integrated multi-chip and multi-chip (let) architectures—made waves at this ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

As semiconductor devices continue advancing into more sophisticated packaging schemes, traditional optical inspection technologies are brushing up against physical and computational boundaries. The ...