Comprising a small pc-board with decoupling capacitors on one side and solder balls on the other, the QStack power delivery module attaches directly underneath a BGA package to reduce or eliminate the ...

Editor's note: This article addresses the need for designers of printed circuit boards for nextgen ICs to be savvy about package-on-package technology. New ways of working with sub-assembly printed ...

During BGA layout, traces and fan-outs are placed on one side of the PCB, while bypass decoupling capacitors are on the other side. This is specially necessary if the BGA is high pin count because ...