PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

Can unleaded BGA solder balls potentially grow tin whiskers as tin plated leads do? Annealing seems to be the standard approach for pure tin plated lead devices, but what about BGAs? Are unleaded BGA ...

Having just received a shiny set of PCBs from the fab-house [Devbisme] needed a way to solder the main chip in place. It has a Ball-Grid Array footprint which is notoriously difficult to populate in a ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

One day [Andy] was cruising around eBay and spotted something interesting. Forty Virtex-E FPGAs for two quid each. These are the big boys of the FPGA world, with 512 user IO pins, almost 200,000 logic ...

X-ray and advanced automated techniques combine to create a capable tool for lead-free solder inspection needs. Within two years, solder used in electronics manufactured or sold in Europe must meet ...

Over 81% of new digital designs utilize Field Programmable Gate Arrays (FPGAs). With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is ...

Memory module makers often use X-ray technology to inspect samples taken from a manufactured batch for abnormal soldering joints. BGA connections are not easily accessible from all sides and as a ...