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ieee.org
Wafer Bonding for the Next Generation of Applications
(27:08 Q&A) Dr. Viorel Dragoi, EV Group E. Thallner GmbHFrom the First IEEE Hybrid Bonding Symposium Summary: Hybrid wafer-to-wafer bonding gained over the past decade a significant interest as it can provide major advantages in fabrication of wafer-level interconnects. The process is extremely challenging in terms of surface preparation, as ...
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